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ATP at Full Steam for Embedded Technology 2016

2016-11-16Back

Taipei, Taiwan (November 16, 2016)  – ATP Electronics Inc., the leading manufacturer of embedded Flash and ruggedized SSD and DRAM modules, displays a complete product line of its next generation storage solutions designed, manufactured, and tested from NAND wafer to finished SSD.  New product line displays include new industrial temperature MLC and SLC memory cards, and embedded SSDs utilizing 3D NAND flash.  ATP will showcase these new solutions and related products from Nov 16th to 18th at Embedded Technology 2016 in Yokohama, Japan. ATP booth will be located at # C-30-3.

3D MLC/TLC NAND is primarily characterized for usage in big market SSD usage models in client and enterprise applications. 3D NAND utilization in embedded, industrial applications must be particularly characterized for many other conditions including data retention over temperature variance, cross temperature reliability, and read-only boot usage models among others. To be at the forefront of this technology shift, ATP has taken the initiative with major resource investment into characterization of 3D NAND in such conditions. To learn about these solutions, please visit the ATP Electronica booth at # C-30-3.

For more details about the latest ATP products and solutions, please contact your local ATP representatives, or email info@atpinc.com .

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